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  • Two Components Epoxy Encapsulating with High Thermal Conductivity
  • Two Components Epoxy Encapsulating with High Thermal Conductivity
  • Two Components Epoxy Encapsulating with High Thermal Conductivity
  • Two Components Epoxy Encapsulating with High Thermal Conductivity
  • Two Components Epoxy Encapsulating with High Thermal Conductivity
  • Two Components Epoxy Encapsulating with High Thermal Conductivity
CAS No.: 38891-59-7
Formula: Mixture
EINECS: 230-391-5
Application: Construction, Structural Adhesive
Transport Package: a:20kg/Drum,B: 200kg/Drum 620ml Cartridge ( a 310m
Trademark: Beginor
Samples:
US$ 10/Piece 1 Piece(Min.Order)
| Request Sample
Customization:

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