Customization: | Available |
---|---|
CAS No.: | 7085-85-0 |
EINECS: | 230-391-5 |
Still deciding? Get samples of US$ 1.8/Piece
Request Sample
|
Suppliers with verified business licenses
Audited by an independent third-party inspection agency
Besil 8230 thermal conductive silicone encapsulant
BESIL 8230 is a two-part addition cure RTV. Comparing to condensation cure system.
Keywords:potting for module
FEATURES
• long potting life, But rapidly cured under heat.
• Contain all the ingredients needed for cure with no by-products from the cure mechanism. Deep-section or confined cures are possible.
• Require no post-cure
• Two-part, 1:1 mixing ratio
• Medium viscosity Room temperature cure or rapid heat cure
• Addition cure system: no cure by-products
• Flame retardant: meets Underwriters Laboratories UL 94-V0
• Stable and flexible from -50°C(58°F) to +250°C (432°F)
• Flexible rubber - protects against mechanical shock and thermal cycling stress at components
• Excellent dielectric properties
APPLICATIONS
• Designed to protect against moisture, environmental attack, mechanical and thermal shock as well as vibration especially where good adhesion is required.
• Typical applications include: encapsulation of amplifiers, automotive electronic units, ballast, bleed resistors, connectors, flyback transformers, high voltage resistor packs, lifting magnets, power controllers, power supplies, radio frequency induction transformers and sensing devices.
TYPICAL PROPERTIES
Property |
GB/T |
ASTM |
Unit |
Value A/B |
Colour (Part A/Part B)
|
|
|
|
Black /white |
Viscosity at 23°C (Part A/Part B)¹
|
10247-2008 |
D1084 |
mPa.s |
2100/2500 |
Specific gravity at 23°C (Part A/Part B) |
13354-92 |
D792 |
g/cm3 |
1.52/1.52 |
Catalysed, Mixed 1:1 by weight
|
||||
Potting life at 23°C |
10247-2008 |
D1084 |
mins |
60±10 |
Gel time at 23°C |
10247-2008 |
D1084 |
Hour |
1.5 |
Cure time at 100°C, 70°C |
|
|
minutes |
30, 60 |
Cure time at 23°C |
|
|
Hour |
6 |
Physical properties, cured 30 minutes at 150°C |
||||
Colour |
|
|
|
Black or Gray
|
Specific gravity at 23°C |
13354-92 |
D792 |
g/cm3 |
1.52 |
Durometer hardness |
531.1-2008 |
D2240 |
Shore A |
55±5 |
Tensile strength |
6328-86 |
D412 |
MPa |
2.6 |
Elongation at break |
6328-86 |
D412 |
% |
60 |
Tear strength- die B |
6328-86 |
D624 |
kN/m |
3.5
|
Thermal conductivity |
10297-1998 |
D2214 |
W/(m.K) |
0.8 |
Volume coefficient of thermal expansion |
20673-2006 |
|
ppm |
210 |
Electrical properties, cured 30 minutes at 150°C
|
||||
Dielectric strength, 2mm thickness |
1693-2007 |
D149 |
kV/mm |
20 |
Permittivity at 100Hz/100kHz |
1693-2007 |
D150 |
|
3.00 |
Dissipation factor at 100Hz/100kHz |
1693-2007 |
D150 |
|
0.009 |
Volume resistivity |
1692-92 |
D257 |
Ohm.cm |
1.1x10¹5 |
Comparative tracking index (IEC112) |
1692-92 |
|
|
600
|
Specification writers: These values are not intended for use in preparing specifications.