Customization: | Available |
---|---|
Bonding Function: | Instant Adhesive |
Morphology: | Water Emulsion |
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Product name |
Thermal conductivity high-temperature resistance epoxy potting material |
Volume | Part A :9kg/drum Part B: 1kg/plastic pot |
Application |
|
Shelf life | 12 months |
Packing | Drum |
Used for automotive, automotive electronics, power tools, reactors, instruments with high thermal conductivity requirements
of the product package protection.
Properties
|
Test Standard
|
PART A
|
PART B
|
Appearance
|
/
|
Black liquid
|
Transparent liquid
|
Viscosity, cps, 25ºC
|
GB/10247-2008
|
120,000
|
50
|
Density, g/cm3, 25ºC
|
GB/T 13354-92
|
2.3±0.05
|
0.95±0.05
|
Mix rate, by weight
|
/
|
A : B = 9: 1
|
|
Viscosity after mixing, 25ºC
|
GB/10247-2008
|
25ºC,3,500±500
40ºC,1,500± 500
|
|
Potting time,100g, min, 25ºC
|
GB/T13477.5-2002
|
25ºC,110 mins
40ºC,50 mins
|
|
Cured condition
|
GB/T13477.5-2002
|
80ºC*2h or 130ºC*2h
|
|
Hardness, shore D
|
GB/T 531.1-2008
|
70-85
|
|
Thermal Conductivity, W/M.K
|
GB/T 10297-1998
|
1.0
|
|
Coefficient of expansion
|
GB 6328-86
|
<Tg, 30
<Tg, 88
|
|
Shear strength, N/mm
|
GB 6328-86
|
>10
|
|
Temperature Range,ºC,
|
DSC
|
-50-200
|
|
Coefficient of Thermal Expansion
|
GB/T 20673-2006
|
60
|
Avoid the sun and heat, stock under sealing.
Shelf life at 25ºC : Part A 12 months, part B 12 months; if expired should be tested first.